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2.4 mm Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-7810245, 2 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with StandardBox.py) (https://www.bourns.com/docs/Product-Datasheets/SRF1260.pdf Bourns SRP1245A SMD inductor http://www.bourns.com/docs/Product-Datasheets/SRP1245A.pdf Bourns SRP1245A SMD inductor Inductor, Bourns, SRP5030T, 5.7mmx5.2mm (Script generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 24 Pin (https://www.ti.com/lit/ml/msop002a/msop002a.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/3-H-7.5 Terminal Block, 1719406 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719406), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.25 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 9x9 mm Body [TQFP] With Exposed Pad Variation BB; (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xx-DV-PE-LC, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Hirose series connector, 505405-1270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xxx-DV-BE-LC, 9 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1130, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-3)), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 6.73 mm (264 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 8.9 mm.

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