Labels Milestones
BackModule, column spacing 22.86 mm (900 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 3x-dip-switch SPST , Slide, row spacing.
- The lineage in the term "modification.
- This project is copied below. The MIT License.
- Switch between 5v and 2.5v.