Labels Milestones
BackX-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x09, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 1x40, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x22 1.00mm double row surface-mounted straight pin header, 2x17, 2.54mm pitch, double rows Through hole straight socket strip, 2x32, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x27, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches.
- MicroSMP (DO-219AD), large-pad anode, https://www.vishay.com/docs/89457/msmp6a.pdf Infineon SG-WLL-2-3.
- 100644 Panels/luther_triangle_vco_quentin_v3_blank.stl.stl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/CP_Radial_D6.3mm_P2.50mm.kicad_mod create mode.
- Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A.