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48c8a4e4f4 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/FIREBALL VCO.png differ Binary files a/Panels/futura medium condensed bt.ttf' Delete 'Panels/futura light bt.ttf' Delete 'Panels/Futura XBlk BT.ttf' Panels/Futura XBlk BT.ttf | Bin 10174 -> 0 bytes Binary files /dev/null and b/Examples/precadsr.pdf differ hole_vdist = 44.5; hole_hdist = 65; hole_diameter = 2; // plastic walls are 2mm clf_shaft_diameter = 6.3; // the hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1923982 16A (HC Generic Phoenix Contact SPT 1.5/7-H-3.5 Terminal Block, 1990779 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990779), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 11, Wuerth electronics 9774025943 (https://katalog.we-online.de/em/datasheet/9774025943.pdf), generated with kicad-footprint-generator JST SH side entry JST NV side entry JST XH series connector, S11B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package - 9x9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline No-Lead 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm.

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