Labels Milestones
BackAlso compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-10DP-2DSA, 5 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B6B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2051, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
- Mounted socket strip SMD 2x17 1.00mm double row.
- System, 43045-0621 (alternative finishes: 43045-222x.