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12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm.

• Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE.
• Normal 4.463730e-08 1.000000e+00 0.000000e+00 facet.

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