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Back# LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated holes unplated through holes: ============================================================= f51b7b97734e404127fa5d5d263acbfd66f116e4 Add schematic, start on PCB Checkpoint after tweaking footprints some more, starting over at 14hp PCB initial layout, no traces Fireball/Fireball.kicad_prl | 2 .../Unseen Servant/Unseen Servant.kicad_prl | 2 .../Unseen Servant/Unseen Servant.kicad_pro | 6 Fireball/fp-info-cache | 23 (format (units 3) (units_format 1) (precision 4 (style (thickness 0.15) (arrow_length 1.27) (text_position_mode 0) (extension_height 0.58642) (extension_offset 0) keep_text_aligned (text "Kassu used 1 µF \npolyester film looks much \nbetter. Low-Power, Quad-Operational Amplifiers, DIP-14/SOIC-14/SSOP-14