Labels Milestones
BackSocket 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TS, Slide, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62.
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