3
1
Back

9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header SMD 2x24 1.00mm double row surface-mounted straight socket strip, 1x04, 1.00mm pitch, single row (from Kicad 4.0.7!), script generated Through hole angled socket strip SMD 1x39 1.27mm single row Through hole straight socket strip, 1x09, 2.00mm pitch, double rows Surface mounted pin header THT 1x21 2.54mm single row Through hole angled socket strip, 2x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header THT 2x05 2.00mm double row Through hole straight pin header, 2x23, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x15, 2.54mm pitch, 6mm pin length, single row Through hole straight pin header, 2x18, 2.54mm pitch, double.

New Pull Request