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Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for the Program (independent of having been made by Sharp Solid State relais SSR Sharp Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x13 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x09, 5.08mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole pin header SMD 1x17 1.27mm single row Surface mounted pin header THT 1x33 2.54mm single row Through hole angled socket strip THT 2x10 2.54mm double row Through hole straight pin header, 2x30, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x15 1.27mm single row Through hole pin header SMD 1x06 1.00mm single row Surface mounted socket strip SMD 1x25 1.27mm single row Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header SMD 1x20 1.27mm single row style2 pin1 right Through hole pin header THT 2x07 2.54mm double row Through hole angled pin header, 2x37, 2.54mm pitch, single row Through hole socket strip SMD 1x03 2.54mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x25, 2.00mm pitch, double rows Surface mounted pin header SMD 2x38 2.00mm double row surface-mounted straight pin header, 2x22, 2.00mm pitch, double rows Surface mounted pin header THT 2x25 2.54mm double row surface-mounted straight pin header, 2x38, 1.00mm pitch, 2.0mm pin length, double cols.

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