Labels Milestones
BackTSOP I, 32 pins, through hole 2.7mm, height 4, Wuerth electronics 9774090982 (https://katalog.we-online.de/em/datasheet/9774090982.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x30 2.54mm single row Through hole horizontal IDC box header THT 2x24 1.27mm double row Through hole angled pin header THT 1x06 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x11, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x40, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x26 1.27mm double row Through hole socket strip SMD 2x08.
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