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Vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SS)-5.30 mm Body [HTSSOP], with thermal vias in pads, 2 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM16B-SHLS-TF.

11.2377 vertex -3.18698 8.1203 12.5948 facet.
205-00065 45Degree pitch 5mm size 62.3x14mm^2.

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