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Created on Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: merged pull request synth_mages/MK_VCO#4 24955050f1 Merge pull request synth_mages/MK_VCO#5 613d1b6f7e.

M234 Rohm HRP7 SMD package, orientation marker.
Diode TO-263 / D2PAK .
Mode 100755 Panels/FireballSpell_Large_bw.xcf surface("FireballSpellSmall.png.

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