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4.5x2.0mm^2 package SMD Crystal Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, hand-soldering, 10.5x5.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-210 https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-210SED, 2.5x2.0mm^2 package SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, hand-soldering, 11.4x4.7mm^2 package SMD Crystal EuroQuartz EQ161 series http://cdn-reichelt.de/documents/datenblatt/B400/PG32768C.pdf, hand-soldering, 3.2x1.5mm^2 package SMD SMT ceramic resonator filter CSTLSxxxG Ceramic Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, 7.0x5.0mm^2 package SMD Crystal MicroCrystal CC8V-T1A/CM8V-T1A series https://www.microcrystal.com/fileadmin/Media/Products/32kHz/Datasheet/CC8V-T1A.pdf, 2.0x1.2mm^2 package SMD Crystal TXC 7M http://www.txccrystal.com/images/pdf/7m-accuracy.pdf, 3.2x2.5mm^2 package SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25 FBGA-78, 10.5x9.0mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP.

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