Labels Milestones
BackDSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole straight socket strip, 2x01, 2.00mm pitch, double rows Through hole angled pin header THT 1x02 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x20 2.00mm double row surface-mounted straight pin.
- GH top entry connector.
- UQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/drv8308.pdf#page=56 JEDEC MO-220 variation.
- DPDT IM-relay FRT5 Kemet signal.
- HLE-138-02-xxx-DV-LC, 38 Pins per row.
- | Standard switching diode, DO-35.