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BackMask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape Fireball/Fireball_panel.kicad_pro Normal file Unescape module label(string, size=4, halign="center", font="Futura XBlk BT:style=Extra Black") { //} // draw a "vertical" wall to mount the circuit board sideways on // h = knob_height, $fn = smooth } module audio_jack_3_5mm() { } module make_surface(filename, h) { cylinder(r=hole_r, h=thickness*2); echo("Putting a hole with radius: ", hole_r , " at ", width_mm - h_margin; input_column = h_margin; col_right = width_mm - thickness*2.2; left_rib_x = thickness * 1; right_rib_x = width_mm - 9.5/2 - right_rib_thickness - tolerance; // left_panel_width = 16.5+16.5+10.5; //two knob, one jack, plus space between two resistors Properly assign potentiometer pads and trace routing to de-bodge the pots. 's notes on updating the fireball for rev 2 d89db83df1 revised README.md to rev 2 beta by adding +5V, and both trigger/gate and CV routing Latest commits for file Panels/title_test_36.stl Latest commits for file Schematics/MK_VCO_RADIO_SHAEK_try1.diy Binary files /dev/null and b/3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/Panels/SPIDER CLIMB.png' Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/MIRROR IMAGE.png' d48d677c91 Delete '3D Printing/Panels/image.png' 6523065365 Go to file 6523065365 updates the potentiometer pads and thermal vias; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster.
- Chemi-Con, 4.0x5.7mm SMD capacitor, aluminum.
- Vertex 2.0532 2.04871 18.9333.
- 5267-04A, 4 Pins per row, Mounting: Snap-in.
- Https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition.
- Connector, S14B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator.