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With large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wire, reinforced insulation, conductor diameter.

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