Labels Milestones
BackAnd sot337-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 28 leads; body width 4.4 mm; thermal pad with vias HTSSOP, 20 Pin (JEDEC MO-153 Var CD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE.
- B08B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex.
- -0.410784 -6.33956 7.82455 facet.