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3x3 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator connector.

• 4.29047 5.40904 7.37319 vertex -4.27288 5.22414.
• 18-lead though-hole mounted DIP package, row spacing.

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