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Drills, http://www.alps.com/prod/info/E/HTML/Encoder/Incremental/EC12E/EC12E1240405.html & http://cdn-reichelt.de/documents/datenblatt/F100/402097STEC12E08.PDF Alps rotary encoder, PEC09, without switch, vertical shaft, mounting holes to PCB edge 4.9399999999999995mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 25-pin D-Sub connector horizontal angled 90deg THT male pitch 2.77x2.54mm pin-PCB-offset 9.4mm 62-pin D-Sub connector horizontal angled 90deg THT male pitch 2.77x2.84mm pin-PCB-offset 9.4mm 26-pin D-Sub connector horizontal angled 90deg THT male pitch 2.77x2.84mm pin-PCB-offset 4.9399999999999995mm mounting-holes-distance 33.3mm mounting-hole-offset 33.3mm 15-pin D-Sub connector horizontal angled 90deg THT female pitch 2.77x2.84mm pin-PCB-offset 14.56mm mounting-holes-distance 33.3mm mounting-hole-offset 33.3mm 26-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, male, pitch 2.77x2.84mm, distance of mounting holes distance 47.1mm 25-pin D-Sub connector straight rugged MUSB D511 USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin, exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-85/ Infineon SO package 20pin without exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin without exposed pad (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-87/ 12-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline No-Lead http://www.ti.com/lit/ml/mpds176e/mpds176e.pdf Plastic Small Outline (ST)-4.4 mm Body (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.fujitsu.com/ca/en/Images/MB85RS2MT-DS501-00023-1v0-E.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-LC, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, B07B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XH series connector, B3PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xx-DV-PE-LC, 21 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator JST PH series connector, 502386-0870 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 38.

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