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Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted pin header THT 2x04 1.27mm double row surface-mounted straight pin header, 2x22, 2.00mm pitch, 6.35mm socket length, single row Through hole IDC box header THT 2x04 2.54mm double row Through hole socket strip THT 2x38 2.54mm double row surface-mounted straight pin header, 2x02, 2.54mm pitch, double rows Surface mounted pin header THT 2x37 2.00mm double row Through hole angled socket strip SMD 2x24 1.27mm double row Through hole socket strip THT 1x33 1.00mm single row Through hole socket strip THT 1x22 1.00mm single row Through hole pin header SMD 2x14 2.00mm double row Through hole straight pin header, 2x11, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x38 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x08 1.00mm double row surface-mounted straight pin header, 1x30, 1.00mm pitch, 2.0mm pin length, single row Through hole angled pin header THT 1x10 2.54mm single row Surface mounted socket strip THT 1x09 2.54mm single row style2 pin1 right Through hole straight socket strip, 1x07, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 2x12 2.00mm double row Through hole pin header SMD 1x06 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x05 1.00mm single row male, vertical entry, strain relief clip Harwin Male Horizontal Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89015xx, 15 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole ST Morpho Connector 144 STLink AI accelerated MCU with optional wifi, https://dl.sipeed.com/MAIX/HDK/Sipeed-M1&M1W/Specifications AI Kendryte K210 RISC-V Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-08P-1.25DS, 8 Pins per.

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