Labels Milestones
BackNSMD, YZP0005 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight socket strip, 2x30, 2.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x21, 2.00mm pitch, single row Surface mounted socket strip THT 2x04 2.54mm double row Through hole angled socket strip THT 1x32 2.54mm single row Through hole vertical IDC box header THT 1x19 2.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket.
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