3
1
Back

3.0x1.9x0.625mm, 28 ball 7x4 area grid, YZR pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole IDC header, 2x05, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x14 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x14 2.00mm single row Surface mounted pin header SMD 1x34 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 1x36, 2.00mm pitch, double rows Through hole angled socket strip, 1x24, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x02 1.00mm single row Through hole angled pin header, 2x17, 1.27mm pitch, double rows Through hole pin header THT 1x27 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x39 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x06, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x19, 2.54mm pitch, double rows Through hole straight socket strip, 2x08, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x19, 1.27mm pitch, double.

New Pull Request