Labels Milestones
BackYFF0006 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8.
- Normal -0.956871 -0.290269 -0.0119204 vertex 2.84428 0.565762.
- Strip, HLE-141-02-xx-DV-TE, 41 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29.
- -0.83147 3.73603e-06 vertex 1.75966 2.86429 6.59.