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BackNLV25, 2.5x2.0x1.8mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, SLF6025, 6.0mmx6.0mm (Script generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter.
- 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu.
- 4711 lines 2 5mm.
- -4.98277 4.13938 7.73103 facet normal 0.268373.
- Two walls in parallel, close.