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BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator connector Harting har-flexicon series connector, 53261-1371 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, 505405-0870 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.15 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 7, Wuerth electronics 9774080951 (https://katalog.we-online.de/em/datasheet/9774080951.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 3, Wuerth electronics 9774050982 (https://katalog.we-online.de/em/datasheet/9774050982.pdf), generated with kicad-footprint-generator JST GH side entry Molex LY 20 series connector, SM20B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator JST J2100 series connector, S13B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105309-xx06, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST XA series connector, S12B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2028, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 202396-0807 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.25 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend.

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