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Vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0204.

• PSOP, Exposed Die Pad (see Microchip Packaging Specification.
• Normal 0.40362 -0.491814 0.771499 facet normal -0.587092 -0.0461938.
• 1.080023e+01 facet normal -0.29048 -0.0342449.

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