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Package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 2 SMD power inductor, CWR1242C, H=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cwr12xx smd Sagami power inductor, CWR1242C, H=4.5mm (http://www.sagami-elec.co.jp/file/16Car_SMDCwr.pdf inductor sagami cwr12xx smd Sagami power inductor, 5.8x5.2x4.5mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Ferrocore DLG-1005 unshielded SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5341 Microsemi Powermite 3 SMD power inductor, 0808, 1.9x2.0mm, https://www.coilcraft.com/getmedia/50382b97-998f-4b75-b5ee-4a93b0ac4411/xfl2010.pdf Wire Wound Chip Common Mode Choke, https://www.coilcraft.com/pdfs/0805usb.pdf Coilcraft 1812CAN Series Common Mode Line Filter API Delevan, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x21.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 9x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 4x-dip-switch SPST , Slide, row spacing 5.9 mm (232 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST CTS_Series194-12MSTN.

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