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Level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115.

• 0.866026 8.06266e-08 vertex -2.35938 -1.82407 11.0482.
• Normal -6.968262e-001 -7.172400e-001 0.000000e+000 vertex 4.044623e+000 -2.334935e+000 2.464800e+001.

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