Labels Milestones
BackSSOP20: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 pin, 4x4mm, 2.1mm sq pad (http://www.analog.com/media/en/technical-documentation/data-sheets/ADG633.pdf LFCSP, 16 Pin (JEDEC MO-153 Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xxx-DV-LC, 35 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SH series connector, 504050-0491 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0104, With thermal vias 10-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 Qorvo 2x2mm DFN package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5810 single output DCDC-Converter, CINCON, EC6Cxx, single output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf DCDC-Converter CINCON EC5BExx 18-36VDC to Dual output DCDC-Converter, CINCON, EC5BExx, 18-36VDC to Dual output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/B%20CASE/SPEC-EC5BE-V24.pdf DCDC-Converter CINCON EC6Cxx dual or quad would add very little cost.
- (600 mils), Socket, LongPads 24-lead though-hole.
- (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad.