3
1
Back

Definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.diodes.com/assets/Package-Files/U-DFN2018-6.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSOP, 8 Pin (https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 2, Wuerth electronics 9774100360 (https://katalog.we-online.de/em/datasheet/9774100360.pdf), generated with kicad-footprint-generator XP_POWER IHxxxxS.

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