3
1
Back

Dual Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [HTSSOP], with thermal pad with vias; (http://www.ti.com/lit/ds/symlink/drv8800.pdf HTSSOP, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4001f.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6.

New Pull Request