3
1
Back

Pitch=25.4mm, 3W, length*width*height=22.2*8*8mm^3, shunt pin pitch 9.00mm 2W length 17mm diameter 6mm width 2.5mm solder Pin_ with flat with fork, hole diameter 0.5mm test point SMD pad as test Point, diameter 1.5mm SMD pad SMD pad as test Point, diameter 2.5mm SMD pad as test point, pitch 6.35mm, hole diameter 1.85mm wire loop as test point, loop diameter2.6mm, hole diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B2PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT.

New Pull Request