synth_tools

Back

Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/16L_VQFN-WFS_3x3mm_4MX_C04-00508a.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 64 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/adv7611.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV-BE, 41 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0006 example for new part number: 22-27-2061, 6 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B3B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-60DP-0.5V, 60 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 12-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin Placed - Wide, 5.3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf Fairchild Power33 MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/ TO-50-3 Macro T Package Style M234 Rohm HRP7 SMD package, http://www.ti.com/lit/ds/symlink/lm4755.pdf D2PAK DDPAK TO-263 D2PAK-3 TO-263-3 SOT-404 TO-263 / D2PAK / DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package for diode bridges, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.

New Pull Request

Labels Milestones