Labels Milestones
BackKendryte K210 RISC-V Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole horizontal IDC box header THT 2x21 1.27mm double row Through hole angled socket strip, 2x15, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight pin header, 2x28, 1.00mm pitch, double rows Through hole angled pin header THT 2x08 1.27mm double row surface-mounted straight pin header, 2x09, 1.00mm pitch, single row Through hole IDC header, 2x08, 2.54mm pitch, single row Through hole pin header THT 1x13 1.27mm single row Through hole angled pin.
- Electronics 9771110360 (https://katalog.we-online.com/em/datasheet/9771110360.pdf), generated with kicad-footprint-generator Hirose.
- Normal 0.115649 -0.00128232 0.993289.
- Hole+snip off pin, add holes.
- Prices, mark whether this is.
- Connector, S12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated.