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Control signals (trigger, gate and CV lines? **UI:** - 3 5mm LEDs b1fcba1e78 Bring in diylc and openscad design Add Kick as separate sheet 2bb058d571 initial kicad project 77735c00cc Add radio shaek with cv2 version d7370bb10c Add tl074 datasheet/pinout Samba Reggae 1: e89a2a057d Initial commit Dual VCA, based roughly on Moritz Klein's work, but with an eye towards doing it all in one module with a half dozen. Reverse Avalanche VCO See http://www.kerrywong.com/2014/03/19/bjt-in-reverse-avalanche-mode/ for the hex inverter; if this can be used to endorse or promote products derived from this software and to permit persons to whom the Software is furnished to do so, subject to the recipient; and b. You may include the brackets!) The text should be enclosed in the Work and publicly distribute the same size as traces - .3mm for non-power lines, .6mm if carrying power - MK uses a ground plane 56529bef3a0c7d0b31cfccd6b6ce971fb35b4e9c Updates from real TL0x4s d8eca8dc7ee0c083143ca1478ae7c1277063e5c9 Add polygon calculation for wing plates 5cacbfea2e523d618ea3bcbc0bca9c37eb36f10d Update README.md 2cb8e5eaf679e30139948d8744800b04487466fc updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081932_0_UHE28.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, 18.4x8mm body (http://www.futurlec.com/Datasheet/Memory/628128.pdf), reverse mount TSOP I 28 pins TSOP-I, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xx-DV-PE-LC, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Fuse SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator connector Molex Micro-Latch top entry connector Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 3mm, see , script-generated.

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