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Https://www.st.com/resource/en/datasheet/stm32h7b3ri.pdf ST TFBGA-257, 10.0x10.0mm, 257 Ball, 19x19 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 array, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 2x16, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x36 2.00mm single row Through hole angled pin header THT 1x34 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 2.00mm double row surface-mounted straight pin header, 1x40, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 2x40, 1.27mm pitch, double rows Surface mounted pin header SMD 2x25 1.27mm double row surface-mounted straight pin header, 2x08, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x02 1.27mm double row Through hole straight pin header, 2x06, 1.27mm pitch, double cols (from Kicad 4.0.7.

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