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SPT 2.5/8-H-5.0 Terminal Block, 1732425 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732425), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-36S-0.5SH, 36 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator LED SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0080, 8 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1510, with PCB locator, 3 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2 mm² wire, basic insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-132-02-xx-DV-PE-LC, 32 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-116-02-xx-DV-TE, 16 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lmr14030.pdf#page=28, http://www.ti.com/lit/ml/msoi002j/msoi002j.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B12B-PUDSS (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-109-02-xxx-DV-A, 9 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89007xx, 7 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 36 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST GH series connector, B1B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-32XX, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ Infineon SO package 20pin with exposed pad 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11.

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