Labels Milestones
BackSocket 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size.
- (https://www.nxp.com/docs/en/package-information/SOT618-1.pdf), generated with kicad-footprint-generator Molex PicoBlade series.
- 1.012768e+02 1.855000e+01 facet normal -8.104236e-01 -1.684634e-04 5.858443e-01 facet.
- 0.954697 0.292532 0.0545798 facet normal.