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Normal, and normal both GND Glide attenuator (B10k) (join two left pins from below - Clock in socket with 80 contacts (40 each side), through-hole, http://www.4uconnector.com/online/object/4udrawing/10156.pdf 4UCON 10156 Card edge socket with 80 contacts AT ISA 16 bits Bus Edge Connector x1 http://www.ritrontek.com/uploadfile/2016/1026/20161026105231124.pdf#page=70 Highspeed card edge connector for PCB's with 70 contacts (not polarized Highspeed card edge connector for PCB's with 50 contacts (not polarized Highspeed card edge connector for PCB's with 70 contacts (polarized conn samtec card-edge high-speed Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 70 contacts (polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical, alignment pins (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 9x9mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad, thermal vias in pads, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 202396-0507 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1530, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py Halo N6 SO, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24), generated.

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