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Handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin.

• Grid, YZP, YZP0010, 1.86x1.36mm.
• -4.245195e+000 -5.688466e+000 9.983999e+000 vertex 4.519256e+000.
• DEF SW_MEC_5E SW 0 0 Y N 2.
• 6turn HAM0631A Neosid, Micro.
• DEF 2_pin_Molex_connector J 0 40 N N 1.

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