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Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SM) - 5.28 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin, dual row female, vertical entry, PN:G125-FVX3405L0X Harwin Gecko Connector, 20 pins, single row male, vertical entry, no latches, PN:G125-MVX2605L0X Harwin Gecko Connector, 50 pins, dual row female, vertical entry, PN:G125-FVX2605L0X Harwin Gecko Connector, 12 pins, dual row male, vertical entry Harwin LTek Connector, 26 pins, single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x16 2.54mm single row Surface mounted socket strip THT 2x39 2.00mm double row Through hole angled socket strip, 2x13, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x20, 1.27mm pitch, double rows Through hole pin header SMD 2x17 1.00mm double row surface-mounted straight socket strip, 2x36, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x06 2.54mm double row surface-mounted straight pin header, 1x30, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x08 2.54mm double row surface-mounted straight.

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