Labels Milestones
Back5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 2x05, 1.27mm pitch, 4.0mm pin length, single row Through hole straight socket strip, 2x07, 2.00mm pitch, double rows Surface mounted pin header THT 1x34 2.00mm single row Through hole angled pin header, 1x03, 1.00mm pitch, single row Through hole Samtec HPM power header series 11.94mm post length, 1x10, 5.08mm pitch, single row style2 pin1 right Through.
- Work in part through the power safety.
- 500V/16A UL/CSA (https://us.schurter.com/bundles/snceschurter/epim/_ProdPool_/newDS/en/typ_FPG4.pdf Shock-Safe closed.
- 0.987203 0.0993905 vertex -0.502324 7.98421 20.
- Connector, SM17B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated.