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ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, Form 1C, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 7 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 40-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 6.15 mm (242 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 10.16 mm (400 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 7.62mm 300mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

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