Labels Milestones
Back(JQ) - 4x4x0.5 mm Body [HTSSOP], with thermal pad 3x2mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 467, 3.09x3.15mm, 52.
- 178.58 113.14 (end 173.745 115.005 (end 177.88.
- Vertex -6.58293 -0.759029 7.7465 facet normal -0.0818475 0.0808324.
- -6.23601 -4.16677 6.0001 vertex -6.92909.
- GMSTBA_2,5/7-G; number of pins.