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Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Vertical RM 2.54mm staggered type-2 TO-220-7 Horizontal RM 1.27mm staggered type-1 TO-220F-11, Vertical, RM 1.7mm, MultiwattF-11, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-5, Horizontal, RM 2.286mm SIPAK, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 5.08mm TO-126-2, Vertical.

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