3
1
Back

Package; 32 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package.

New Pull Request