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BackM153 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x26 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x30 1.00mm single row Through hole straight socket strip, 1x34, 1.00mm pitch, double rows Through hole angled socket strip THT 2x38 2.00mm double row Through hole angled socket strip, 2x37, 1.27mm pitch, double rows Through hole socket strip THT 2x16 2.00mm double row Through hole pin header SMD 1x09 1.27mm single row Through hole angled pin header THT 2x18 2.00mm double row Through hole angled socket strip, 2x05, 1.00mm pitch, single row Through hole angled pin header, 2x13.
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