3
1
Back

4x4, 0.5P; CASE 506CN (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 1x11 1.27mm single row Surface mounted pin header SMD 2x29 2.00mm double row surface-mounted straight pin header, 2x28, 2.54mm pitch.

New Pull Request