3
1
Back

Power-Integrations variant of 8-Lead Plastic Small Outline (SM) - 5.28 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP.

New Pull Request